Micromechanics-BE solution for properties of piezoelectric materials with defects (Q2486467): Difference between revisions

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+Weakening of an Elastic Solid by a Rectangular Array of Cracks
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+Elastic moduli of a non-randomly cracked body
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+Elastic moduli of a cracked solid
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+A generalized self-consistent mechanics method for microcracked solids
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+Effective moduli of piezoelectric material with microcavities
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+The differential scheme and its application to cracked materials
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+Thermoelectroelastic analysis of cracks in piezoelectric half-plane by BEM
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+BEM for crack-inclusion problems of plane thermopiezoelectric solids
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+A boundary integral formulation and 2D fundamental solutions for piezoelectric media
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