Micromechanics-BE solution for properties of piezoelectric materials with defects

DOI10.1016/j.enganabound.2003.12.006zbMath1130.74470OpenAlexW2094448342MaRDI QIDQ2486467

Qing-Hua Qin

Publication date: 5 August 2005

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2003.12.006

zbMATH Keywords

Boundary element methodMicromechanicsPiezoelectricCrack

Mathematics Subject Classification ID

Boundary element methods applied to problems in solid mechanics (74S15) Micromechanics of solids (74M25) Electromagnetic effects in solid mechanics (74F15)

Related Items (2)

Application of the grain boundary formulation and image processing-based algorithm in micro-mechanical analysis of piezoelectric ceramic ⋮ Numerical determination of effective properties of voided piezoelectric materials using BNM

Cites Work

• The differential scheme and its application to cracked materials
• Elastic moduli of a cracked solid
• Elastic moduli of a non-randomly cracked body
• Effective moduli of piezoelectric material with microcavities
• A generalized self-consistent mechanics method for microcracked solids
• Thermoelectroelastic analysis of cracks in piezoelectric half-plane by BEM
• A boundary integral formulation and 2D fundamental solutions for piezoelectric media
• Weakening of an Elastic Solid by a Rectangular Array of Cracks
• BEM for crack-inclusion problems of plane thermopiezoelectric solids

This page was built for publication: Micromechanics-BE solution for properties of piezoelectric materials with defects