Thermoelectroelastic analysis of cracks in piezoelectric half-plane by BEM
DOI10.1007/S004660050415zbMATH Open0951.74077OpenAlexW2062734397MaRDI QIDQ1807058FDOQ1807058
Authors: Qing H. Qin 
Publication date: 18 December 2000
Published in: Computational Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s004660050415
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Green's functionperturbationboundary element methodpoint heat sourceStroh formalismmultiple crack problemtemperature discontinuitypiezoelectric half-planepotential variational principletwo-crack system
Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15) Stress concentrations, singularities in solid mechanics (74G70)
Cited In (12)
- BEM for crack-inclusion problems of plane thermopiezoelectric solids
- On the conventional boundary integral equation formulation for piezoelectric solids with defects or of thin shapes.
- Hybrid fundamental solution based finite element method: theory and applications
- Green's functions and boundary element method for transversely isotropic piezoelectric materials
- Analysis of thin piezoelectric solids by the boundary element method
- Boundary element modeling of cracks in piezoelectric solids.
- BEM analysis of electrically limited permeable cracks considering Coulomb tractions in piezoelectric materials
- Micromechanics-BE solution for properties of piezoelectric materials with defects
- Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM
- Green's functions for two-phase transversely isotropic magneto-electro-elastic media
- On the half-infinite crack problem in thermo-electro-elasticity
- Boundary integral equations for 2D thermoelectroelasticity of a half-space with cracks and thin inclusions
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