Thermoelectroelastic analysis of cracks in piezoelectric half-plane by BEM

DOI10.1007/S004660050415MaRDI QIDQ1807058zbMATH OpenOpenAlexFDO

Authors Qing H. Qin

Publication date 18 December 2000

Published in Computational Mechanics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s004660050415

zbMATH Keywords

Green's functionperturbationboundary element methodpoint heat sourceStroh formalismmultiple crack problemtemperature discontinuitypiezoelectric half-planepotential variational principletwo-crack system

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15) Stress concentrations, singularities in solid mechanics (74G70)

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Cited in

(12)

• On the conventional boundary integral equation formulation for piezoelectric solids with defects or of thin shapes.
• Green's functions for two-phase transversely isotropic magneto-electro-elastic media
• Hybrid fundamental solution based finite element method: theory and applications
• Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM
• Boundary integral equations for 2D thermoelectroelasticity of a half-space with cracks and thin inclusions
• On the half-infinite crack problem in thermo-electro-elasticity
• BEM analysis of electrically limited permeable cracks considering Coulomb tractions in piezoelectric materials
• Green's functions and boundary element method for transversely isotropic piezoelectric materials
• Micromechanics-BE solution for properties of piezoelectric materials with defects
• BEM for crack-inclusion problems of plane thermopiezoelectric solids
• Boundary element modeling of cracks in piezoelectric solids.
• Analysis of thin piezoelectric solids by the boundary element method

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