Thermal stress intensity factors for an interface crack in a functionally graded layered structures (Q363630): Difference between revisions

@@ Property / author @@
+Sheng-Hu Ding
@@ Property / author: Sheng-Hu Ding / rank @@
+Normal rank
@@ Property / author @@
+Xing Li
@@ Property / author: Xing Li / rank @@
+Normal rank
@@ Property / Mathematics Subject Classification ID @@
+R10
@@ Property / Mathematics Subject Classification ID: 74R10 / rank @@
+Normal rank
@@ Property / Mathematics Subject Classification ID @@
+G70
@@ Property / Mathematics Subject Classification ID: 74G70 / rank @@
+Normal rank
@@ Property / Mathematics Subject Classification ID @@
+F05
@@ Property / Mathematics Subject Classification ID: 74F05 / rank @@
+Normal rank
@@ Property / Mathematics Subject Classification ID @@
+E05
@@ Property / Mathematics Subject Classification ID: 74E05 / rank @@
+Normal rank
@@ Property / zbMATH DE Number @@
+6204144
@@ Property / zbMATH DE Number: 6204144 / rank @@
+Normal rank
@@ Property / zbMATH Keywords @@
+functionally graded layered structure (FGLS)
@@ Property / zbMATH Keywords: functionally graded layered structure (FGLS) / rank @@
+Normal rank
@@ Property / zbMATH Keywords @@
+thermal resistance
@@ Property / zbMATH Keywords: thermal resistance / rank @@
+Normal rank
@@ Property / zbMATH Keywords @@
+thermal stress intensity factors (TSIFs)
@@ Property / zbMATH Keywords: thermal stress intensity factors (TSIFs) / rank @@
+Normal rank

Revision as of 12:10, 28 June 2023