Pages that link to "Item:Q363630"
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The following pages link to Thermal stress intensity factors for an interface crack in a functionally graded layered structures (Q363630):
Displayed 5 items.
- Thermal stresses factors of orthotropic graded layers with a finite line bond (Q398158) (← links)
- Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer (Q398566) (← links)
- Fracture analysis of a nonhomogeneous coating/substrate system with an interface under thermal shock (Q405024) (← links)
- Thermoelastic analysis of nonhomogeneous structural materials with an interface crack under uniform heat flow (Q1732156) (← links)
- Thermal shock fracture of a crack in a functionally gradient half-space based on the memory-dependent heat conduction model (Q1989005) (← links)