Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159): Difference between revisions

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Thermal-mechanical interface crack behaviour of a surface mount solder joint
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    Thermal-mechanical interface crack behaviour of a surface mount solder joint (English)
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    12 January 1999
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    lead-tin solder joint
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    large residual shear displacement
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    thermal effect
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    \(J\)-integral
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