Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570): Difference between revisions
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Revision as of 13:43, 14 February 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
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Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (English)
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8 December 2021
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stress intensity factor
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thermally insulated cracks
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bonded dissimilar materials
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hypersingular integral equation
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