Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570): Difference between revisions
From MaRDI portal
Changed an Item |
Set profile property. |
||
| Property / MaRDI profile type | |||
| Property / MaRDI profile type: MaRDI publication profile / rank | |||
Normal rank | |||
Revision as of 05:42, 5 March 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
scientific article |
Statements
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (English)
0 references
8 December 2021
0 references
stress intensity factor
0 references
thermally insulated cracks
0 references
bonded dissimilar materials
0 references
hypersingular integral equation
0 references
