Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570): Difference between revisions
From MaRDI portal
Set profile property. |
Set OpenAlex properties. |
||
| Property / full work available at URL | |||
| Property / full work available at URL: https://doi.org/10.1016/j.apm.2020.09.054 / rank | |||
Normal rank | |||
| Property / OpenAlex ID | |||
| Property / OpenAlex ID: W3092458453 / rank | |||
Normal rank | |||
Revision as of 21:40, 19 March 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
scientific article |
Statements
Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (English)
0 references
8 December 2021
0 references
stress intensity factor
0 references
thermally insulated cracks
0 references
bonded dissimilar materials
0 references
hypersingular integral equation
0 references
