Solution of problem of two dissimilar materials bonded at one interface subjected to temperature (Q2511664): Difference between revisions

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+The Elastic Strip Under Mixed Boundary Conditions
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+Normal rank
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+Stress Analysis for Bonded Layers
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+Normal rank
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+The Plane Solution for Joined Dissimilar Elastic Semistrips Under Tension
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+The plane solution for bending of joined dissimilar elastic semi-infinite strips
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+A Semi-Infinite Elastic Strip Bonded to an Infinite Strip
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+Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface
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+Stress singularities in a bimaterial joint with inhomogeneous temperature distribution
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+Q5327757
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+Normal rank
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+Stress analysis for a strip with semi-elliptical notches or cracks on both sides by means of rational mapping function
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+Stress analysis of a semi-infinite plate with an oblique edge crack
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+Debondings at a Semielliptic Rigid Inclusion on the Rim of a Half Plane
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