Analysis of fatigue delamination growth in flip-chip package (Q478321): Difference between revisions
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Latest revision as of 10:10, 9 July 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Analysis of fatigue delamination growth in flip-chip package |
scientific article |
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Analysis of fatigue delamination growth in flip-chip package (English)
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3 December 2014
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