Thermal-mechanical interface crack behaviour of a surface mount solder joint (Q1274159): Difference between revisions
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Latest revision as of 10:21, 30 July 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermal-mechanical interface crack behaviour of a surface mount solder joint |
scientific article |
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Thermal-mechanical interface crack behaviour of a surface mount solder joint (English)
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12 January 1999
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lead-tin solder joint
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large residual shear displacement
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thermal effect
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\(J\)-integral
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