General solutions for thermopiezoelectrics with various holes under thermal loading

DOI10.1016/S0020-7683(99)00225-5zbMath0999.74052OpenAlexW2094972730MaRDI QIDQ1579965

Qing-Hua Qin

Publication date: 28 November 2002

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(99)00225-5

zbMATH Keywords

circlefractureintegral equationStroh's formalismstationary solutionpoint heat sourcemethod of conformal mappingsuniform heat flowtemperature discontinuitysquare holeinfinite piezothermoelastic plateinteraction between crack and hole

Mathematics Subject Classification ID

Stress concentrations, singularities in solid mechanics (74G70) Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15)

Related Items (8)

Hybrid fundamental solution based finite element method: theory and applications ⋮ Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory ⋮ Efficient hypersingular line and surface integrals direct evaluation by complex variable differentiation method ⋮ Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method ⋮ Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids ⋮ Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM ⋮ Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects ⋮ Closed-form solutions of an elliptical crack subjected to coupled phonon–phason loadings in two-dimensional hexagonal quasicrystal media

This page was built for publication: General solutions for thermopiezoelectrics with various holes under thermal loading