Analysis of microchannel heat sinks for electronics cooling
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Publication:1870746
DOI10.1016/S0017-9310(02)00180-1zbMath1032.76680OpenAlexW2123667598MaRDI QIDQ1870746
Publication date: 14 May 2003
Published in: International Journal of Heat and Mass Transfer (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0017-9310(02)00180-1
Flows in porous media; filtration; seepage (76S05) Finite difference methods applied to problems in fluid mechanics (76M20) Forced convection (76R05)
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Modeling and simulation on the mass flow distribution in microchannel heat sinks with non-uniform heat flux conditions ⋮ The heat transfer characteristics of liquid cooling heatsink containing microchannels ⋮ A compute-bound formulation of Galerkin model reduction for linear time-invariant dynamical systems ⋮ Numerical study of conjugated heat transfer in metal foam filled double-pipe ⋮ Microscopic and macroscopic approach for natural convection in enclosures filled with fluid saturated porous medium ⋮ Analysis and optimization of the thermal performance of microchannel heat sinks ⋮ Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme
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