Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme

DOI10.1108/09615530510571967MaRDI QIDQ5493085zbMATH OpenOpenAlexFDO

Authors N. Massarotti, J. S. Mathur, Perumal Nithiarasu

Publication date 20 October 2006

Published in International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1108/09615530510571967

Mathematics Subject Classification ID

Finite element methods applied to problems in fluid mechanics (76M10) Free convection (76R10)

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Cites work

• A numerical method for solving incompressible viscous flow problems
• A numerical study on the transient heat transfer from a sphere at high Reynolds and Peclet numbers
• A parallel framework for multidisciplinary aerospace engineering simulations using unstructured meshes
• Accurate 3D viscous incompressible flow calculations with the FEM
• An efficient artificial compressibility (AC) scheme based on the characteristic based split (CBS) method for incompressible flows
• An improved unsteady, unstructured, artificial compressibility, finite volume scheme for viscous incompressible flows: Part I. Theory and implementation
• Analysis of microchannel heat sinks for electronics cooling
• Characteristic‐based‐split (CBS) algorithm for incompressible flow problems with heat transfer
• Numerical Solution of a Uniform Flow over a Sphere at Intermediate Reynolds Numbers
• On boundary conditions of the characteristic based split (CBS) algorithm for fluid dynamics
• Semi‐implicit and explicit finite element schemes for coupled fluid/thermal problems
• Three-dimensional incompressible flow calculations using the characteristic based split(CBS) scheme
• Towards fully parallel aerospace simulations on unstructured meshes

Cited in

(8)

• A unified fractional step method for compressible and incompressible flows, heat transfer and incompressible solid mechanics
• Heat transfer -- a review of 2005 literature
• Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers
• Analysis of an explicit and matrix-free fractional step method for incompressible flows
• Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles
• Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
• A two-step Taylor-characteristic-based Galerkin method for incompressible flows and its application to flow over triangular cylinder with different incidence angles
• Efficient three-dimensional FEM based algorithm for the solution of convection in partly porous domains

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