Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
DOI10.1108/HFF-04-2015-0142zbMATH Open1356.80041OpenAlexW2417376044MaRDI QIDQ2967515FDOQ2967515
Authors: Abderrahmane Baïri 
Publication date: 28 February 2017
Published in: International Journal of Numerical Methods for Heat & Fluid Flow (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1108/hff-04-2015-0142
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Cites Work
- Hybrid lattice-Boltzmann finite difference simulation of convective flows.
- Natural convection melting of NEPCM in a cavity with an obstacle using lattice Boltzmann method
- Mixed convection in two-sided lid-driven differentially heated square cavity
- Numerical simulation of two-dimensional laminar mixed-convection in a lid-driven cavity using the mixed finite element consistent splitting scheme
- Forced convection heat transfer from solder balls on a printed circuit board using the characteristic based split (CBS) scheme
- Application of computational fluid dynamics simulation tools for thermal characterization of electronic packages
- Surface-radiation effect on natural convection flow in a fluid-saturated non-Darcy porous medium enclosed by non-isothermal walls
- Effect of heating location and size on MHD mixed convection in a lid‐driven cavity
- Free convective overall heat transfer coefficient on inclined electronic assembly with active QFN16 package
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