Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers
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Publication:2928784
zbMATH Open1298.76065MaRDI QIDQ2928784FDOQ2928784
Authors: S. Varela, J. A. Ferré, G. Usera, A. Vernet 
Publication date: 10 November 2014
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- Studies on natural convection induced flow and thermal behavior inside electronic equipment cabinet model
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