Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers (Q2928784)
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scientific article; zbMATH DE number 6367689
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| English | Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers |
scientific article; zbMATH DE number 6367689 |
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10 November 2014
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electrical enclosure
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caffa3d.MB
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numerical simulation
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heat transfer
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Numerical simulation of heat transfer and temperature distribution in a printed circuit board enclosure model for different geometries and Reynolds numbers (English)
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0.7493056654930115
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0.723666787147522
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0.7168078422546387
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0.7061462998390198
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