Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique (Q373408)
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| Language | Label | Description | Also known as |
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| English | Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique |
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Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique (English)
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22 October 2013
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interface fracture
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three-dimensional cracks
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complex stress intensity factor
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virtual crack closure technique
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contact
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inner pressure
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electronic package
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