Analysis of fatigue delamination growth in flip-chip package (Q478321)

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Analysis of fatigue delamination growth in flip-chip package
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    title
    Analysis of fatigue delamination growth in flip-chip package (English)
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    author
    Yong-Cai Geng
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    Sumit K. Garg
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    publication date
    3 December 2014
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    zbMATH DE Number
    6376503
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    OpenAlex ID
    W2066344547
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