Applications of FEM for multiple laminated structure in electronic packaging (Q1274174)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Applications of FEM for multiple laminated structure in electronic packaging |
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Applications of FEM for multiple laminated structure in electronic packaging (English)
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12 January 1999
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basic IC model
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IC model with lead fingers
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electronic printed board with solder bump joints
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