Pages that link to "Item:Q2223924"
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The following pages link to Three-dimensional analysis of heat conduction in anisotropic composites with thin adhesive/interstitial media by the boundary element method (Q2223924):
Displaying 4 items.
- Thermal analysis of electronic packaging structure using isogeometric boundary element method (Q2040778) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
- Steady heat transfer analysis for anisotropic structures using the coupled IGA-EFG method (Q6539824) (← links)
- Efficient modeling of heat conduction in multiply bonded composites covered with thermal barrier coating (Q6578002) (← links)
