Thermal analysis of electronic packaging structure using isogeometric boundary element method (Q2040778)
From MaRDI portal
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Thermal analysis of electronic packaging structure using isogeometric boundary element method |
scientific article |
Statements
Thermal analysis of electronic packaging structure using isogeometric boundary element method (English)
0 references
14 July 2021
0 references
IGABEM
0 references
electronic packaging structure
0 references
radial integration method
0 references
multi-scale property of geometry
0 references
nearly singular integrals
0 references
0 references
0 references
0 references
0 references
0 references
0 references
0 references
0 references
0 references
