Thermal analysis of electronic packaging structure using isogeometric boundary element method (Q2040778)
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scientific article; zbMATH DE number 7371624
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| English | Thermal analysis of electronic packaging structure using isogeometric boundary element method |
scientific article; zbMATH DE number 7371624 |
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Thermal analysis of electronic packaging structure using isogeometric boundary element method (English)
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14 July 2021
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IGABEM
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electronic packaging structure
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radial integration method
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multi-scale property of geometry
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nearly singular integrals
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0.7936265468597412
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0.7576133608818054
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0.7570039629936218
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0.756462037563324
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0.7534459829330444
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