Pages that link to "Item:Q2325535"
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The following pages link to The effect of conduction and convective conditions at interstitial regions on 3D thermoelastic contact problems (Q2325535):
Displaying 3 items.
- A boundary element procedure to analyze the thermomechanical contact problem in 3D microelectronic packaging (Q2191601) (← links)
- Thermoelastic influence of convective and conduction interstitial conditions on the size of the contact zone in three-dimensional receding thermoelastic contact problem (Q2194382) (← links)
- 3D thermoelastic solids under non‐linear interface thermal and orthotropic frictional contact conditions (Q6090719) (← links)
