Pages that link to "Item:Q2748545"
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The following pages link to Implementation of surface tension with wall adhesion effects in a three-dimensional finite element model for fluid flow (Q2748545):
Displayed 9 items.
- Three-dimensional simulation of underfill process in flip-chip encapsulation (Q365295) (← links)
- On thermomechanical solids with boundary structures (Q619949) (← links)
- A finite element framework for continua with boundary energies. II: The three-dimensional case (Q649297) (← links)
- A finite element framework for continua with boundary energies. I: The two-dimensional case (Q649479) (← links)
- A finite element framework for continua with boundary energies. III: The thermomechanical case (Q653750) (← links)
- Finite element setting for fluid flow simulations with natural enforcement of the triple junction equilibrium (Q720992) (← links)
- On finite element modelling of surface tension. Variational formulation and applications. I: Quasistatic problems (Q1015511) (← links)
- Surface plasticity: theory and computation (Q1624370) (← links)
- ALE method for solidification modelling (Q2484820) (← links)