Pages that link to "Item:Q1858679"
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The following pages link to Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts (Q1858679):
Displayed 10 items.
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws (Q361949) (← links)
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016) (← links)
- Arc-shaped interfacial crack in a non-homogeneous electro-elastic hollow cylinder with orthotropic dielectric layer (Q399752) (← links)
- Multiple cracks on the interface between a piezoelectric layer and an orthotropic substrate (Q642175) (← links)
- Propagation of a semi-infinite conducting crack in piezoelectric materials: mode-I problem (Q904741) (← links)
- An interaction integral and a modified crack closure integral for evaluating piezoelectric crack-tip fracture parameters in BEM (Q1655350) (← links)
- A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface (Q2306911) (← links)
- Study of a propagating finite crack in functionally graded piezoelectric materials considering dielectric medium effect (Q2428226) (← links)
- Transient response of an annular interfacial crack between dissimilar piezoelectric layers under mechanical and electrical impacts (Q2897199) (← links)
- The extended finite element method with new crack-tip enrichment functions for an interface crack between two dissimilar piezoelectric materials (Q2952761) (← links)