Dynamic stability of flexible electronic structures under step loads
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- Dynamic stability of a thin film bonded to a compliant substrate subjected to a step load with damping
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Cites work
- Buckling of a stiff film bound to a compliant substrate. I: Formulation, linear stability of cylindrical patterns, secondary bifurcations
- Buckling of a stiff thin film on a compliant substrate in large deformation
- Dynamic Analysis of the Buckling of Laterally Loaded Flat Arches
- Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies
- Herringbone Buckling Patterns of Compressed Thin Films on Compliant Substrates
- scientific article; zbMATH DE number 3863589 (Why is no real title available?)
- scientific article; zbMATH DE number 4009931 (Why is no real title available?)
- scientific article; zbMATH DE number 3203164 (Why is no real title available?)
- Instability of a compressed elastic film on a viscous layer
- Kinetic wrinkling of an elastic film on a viscoelastic substrate
- Nonlinear analyses of wrinkles in a film bonded to a compliant substrate
- On dynamic stability of elastic bodies with prescribed initial conditions
- Periodic patterns and energy states of buckled films on compliant substrates
- Wrinkle patterns of anisotropic crystal films on viscoelastic substrates
Cited in
(8)- Buckling analysis and buckling control of thin films on shape memory polymer substrate
- Dynamic stability of a thin film bonded to a compliant substrate subjected to a step load with damping
- Nonlinear vibration of buckled nanowires on a compliant substrate
- Stochastic response of a piezoelectric ribbon-substrate structure under Gaussian white noise
- Dynamic stability analysis of stiff films by element-free method with strain-rotation decomposition
- Nonlinear dynamic analysis for a corrugated thin film on a pre-strained finite-thickness bi-layer substrate
- Spontaneous buckling morphology transition of an elastic ring confined in an annular region constraint
- Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics
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