Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics

DOI10.1007/S10409-017-0670-YMaRDI QIDQ724455zbMATH OpenOpenAlexFDO

Authors Zihao Wang, Boya Liu, Shuodao Wang, Xian-Hong Meng

Publication date 26 July 2018

Published in Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s10409-017-0670-y

zbMATH Keywords

flexible electronicsstickup statethird-order polynomialsvirtual work principle

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

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Cites work

• A High-Order Theory of Plate Deformation—Part 1: Homogeneous Plates
• A Simple Higher-Order Theory for Laminated Composite Plates
• An Improved Shear-Deformation Theory for Moderately Thick Multilayered Anisotropic Shells and Plates
• Large deflection analysis of laminated composite plates
• On asymptotic expansions for the sixth-order linear theory problem of transverse bending of orthotropic elastic plates
• Transcendence of certain trigonometric series
• Zigzag theory for composite laminates

Cited in

(3)

• A strain-isolation design for stretchable electronics
• Splitting of the neutral mechanical plane depends on the length of the multi-layer structure of flexible electronics
• An analytic model for transient heat conduction in bi-layered structures with flexible serpentine heaters

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