A strain-isolation design for stretchable electronics
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Recommendations
- Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?
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- Reprint of ``Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates [In. J. solids struct. 45 (2008) 2014-2023]
- Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates
Cites work
- Buckling of a stiff film bound to a compliant substrate. I: Formulation, linear stability of cylindrical patterns, secondary bifurcations
- Buckling of a stiff film bound to a compliant substrate. II: A global scenario for the formation of herringbone pattern
- Buckling of a stiff film bound to a compliant substrate. III: Herringbone solutions at large buckling parameter
- Buckling of a stiff thin film on a compliant substrate in large deformation
- Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
- Effect of elastic anisotropy on surface pattern evolution of epitaxial thin films
- Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies
- Herringbone Buckling Patterns of Compressed Thin Films on Compliant Substrates
- Kinetic wrinkling of an elastic film on a viscoelastic substrate
- Nonlinear analyses of wrinkles in a film bonded to a compliant substrate
- Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates
- Wrinkle patterns of anisotropic crystal films on viscoelastic substrates
Cited in
(5)- Analysis of an elongated stretched strip, with application to a strain‐gage electrical sensor design
- An efficient computational method for curved interconnects deformation
- Postbuckling analysis and its application to stretchable electronics
- Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?
- Third-order polynomial model for analyzing stickup state laminated structure in flexible electronics
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