Reprint of ``Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates [In. J. solids struct. 45 (2008) 2014-2023]
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Recommendations
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Cites work
Cited in
(10)- Buckling analysis and buckling control of thin films on shape memory polymer substrate
- Postbuckling analysis and its application to stretchable electronics
- Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?
- A strain-isolation design for stretchable electronics
- A semi-numerical algorithm for instability of compressible multilayered structures
- Multiscale buckling and post-buckling analysis: a comprehensive review
- A validated energy approach for the post-buckling design of micro-fabricated thin film devices
- Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates
- Buckling and postbuckling of a compressed thin film bonded on a soft elastic layer: a three-dimensional analysis
- Dynamic stability analysis of stiff films by element-free method with strain-rotation decomposition
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