Reprint of ``Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates [In. J. solids struct. 45 (2008) 2014-2023]

DOI10.1016/S0020-7683(08)00168-6zbMATH Open1169.74403MaRDI QIDQ837375FDOQ837375

Authors: H. Jiang, Yugang Sun, John A. Rogers, Yonggang Huang 

Publication date: 10 September 2009

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Recommendations

• Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates
• Postbuckling analysis and its application to stretchable electronics
• Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies
• Buckling analysis and buckling control of thin films on shape memory polymer substrate
• Buckling of a stiff thin film on a compliant substrate in large deformation

zbMATH Keywords

bucklingmechanicsstretchable electronics

Mathematics Subject Classification ID

Thin films (74K35) Bifurcation and buckling (74G60)

Cites Work

• Nonlinear analyses of wrinkles in a film bonded to a compliant substrate
• Herringbone Buckling Patterns of Compressed Thin Films on Compliant Substrates

Cited In (10)

• A semi-numerical algorithm for instability of compressible multilayered structures
• A validated energy approach for the post-buckling design of micro-fabricated thin film devices
• Buckling and postbuckling of a compressed thin film bonded on a soft elastic layer: a three-dimensional analysis
• Dynamic stability analysis of stiff films by element-free method with strain-rotation decomposition
• Postbuckling analysis and its application to stretchable electronics
• Buckling analysis and buckling control of thin films on shape memory polymer substrate
• Multiscale buckling and post-buckling analysis: a comprehensive review
• A strain-isolation design for stretchable electronics
• Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?
• Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates

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