A strain-isolation design for stretchable electronics

DOI10.1007/S10409-010-0384-XzbMATH Open1270.74130OpenAlexW2148591016MaRDI QIDQ362804FDOQ362804

Authors: Ming Li, Dae-Hyeong Kim, Yun-Soung Kim, Zhan Kang, John A. Rogers, W. Q. Chen, Yonggang Huang, Keh-Chih Hwang, Jian Wu 

Publication date: 30 August 2013

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-010-0384-x

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zbMATH Keywords

thin filmadhesivestrain isolationstretchable electronicssubstrate

Mathematics Subject Classification ID

Thin films (74K35) Finite element methods applied to problems in solid mechanics (74S05)

Cites Work

• Nonlinear analyses of wrinkles in a film bonded to a compliant substrate
• Wrinkle patterns of anisotropic crystal films on viscoelastic substrates
• Kinetic wrinkling of an elastic film on a viscoelastic substrate
• Herringbone Buckling Patterns of Compressed Thin Films on Compliant Substrates
• Buckling of a stiff film bound to a compliant substrate. II: A global scenario for the formation of herringbone pattern
• Buckling of a stiff film bound to a compliant substrate. III: Herringbone solutions at large buckling parameter
• Finite width effect of thin-films buckling on compliant substrate: experimental and theoretical studies
• Buckling of a stiff film bound to a compliant substrate. I: Formulation, linear stability of cylindrical patterns, secondary bifurcations
• Buckling of a stiff thin film on a compliant substrate in large deformation
• Effect of elastic anisotropy on surface pattern evolution of epitaxial thin films
• Ductility of thin metal films on polymer substrates modulated by interfacial adhesion
• Post-buckling analysis for the precisely controlled buckling of thin film encapsulated by elastomeric substrates

Cited In (2)

• Analysis of an elongated stretched strip, with application to a strain‐gage electrical sensor design
• Predicted stresses in die-carrier assemblies in ``stretchable electronics: is there an incentive for using a compliant bond?

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