Electronic System Thermal Design for Reliability

DOI10.1109/TR.1977.5220180MaRDI QIDQ4146505zbMATH OpenFDO

Authors

Publication date 1977

Published in IEEE Transactions on Reliability (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1109/TR.1977.5220180

Mathematics Subject Classification ID

Reliability and life testing (62N05) Reliability, availability, maintenance, inspection in operations research (90B25)

Cited in

(2)

• Convective cooling and optimal placement of electronic components with variable ambient temperature. I: The linear model
• A model for the convective cooling of electronic components with application to optimal placement

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