Energy variation in diffusive void nucleation induced by electromigration

DOI10.1007/S10409-020-00963-2MaRDI QIDQ6999605zbMATH OpenFDO

Authors Yuexing Wang, Yao Yao, Zhang Long, Leon M. Keer

Publication date 9 April 2025

Published in Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/S10409-020-00963-2

zbMATH Keywords

diffusionelectromigrationenergyvoid nucleation

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Micromechanics of solids (74M25) Dynamic continuum models (systems of particles, etc.) in time-dependent statistical mechanics (82C21)

Cites work

• A theoretical analysis of the electromigration-induced void morphological evolution under high current density
• An energy approach to predict fatigue crack propagation in metals and alloys
• Damage evolution governed by microcrack nucleation with application to the fatigue of 63Sn-37Pb solder
• Electromigration induced strain field simulations for nanoelectronics lead-free solder joints

Cited in

(1)

• Localization and macroscopic instability in nanoporous metals

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