A theoretical analysis of the electromigration-induced void morphological evolution under high current density

DOI10.1007/S10409-017-0645-ZMaRDI QIDQ1695572zbMATH OpenOpenAlexFDO

Authors Yuexing Wang, Yao Yao

Publication date 7 February 2018

Published in Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s10409-017-0645-z

zbMATH Keywords

analytical solutionelectromigrationhigh current densitymass diffusionvoid evolution

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15)

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Cites work

• A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
• Analytical solution for motion of an elliptical inclusion in gradient stress field
• Creep flow, diffusion, and electromigration in small scale interconnects
• Electromigration of intergranular voids in metal films for microelectronic interconnects.
• Heat conduction and thermal stress induced by an electric current in an infinite thin plate containing an elliptical hole with an edge crack
• scientific article; zbMATH DE number 3084088 (Why is no real title available?)
• Void growth in power-law creeping solids: effect of surface diffusion and surface energy

Cited in

(9)

• Creep flow, diffusion, and electromigration in small scale interconnects
• A thermodynamic model for electrical current induced damage
• Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration
• A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy
• Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
• A phase field model for the electromigration of intergranular voids
• Effect of electromigration on onset of morphological instability of a nanowire
• Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework
• Energy variation in diffusive void nucleation induced by electromigration

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