A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion

DOI10.1016/S0022-5096(97)00013-6zbMath0974.74566OpenAlexW1994566250MaRDI QIDQ1589281

R. Smith

Publication date: 3 January 2001

Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0022-5096(97)00013-6

zbMATH Keywords

surface diffusionelectromigrationvoid evolutiondiffusion driven by surface energyelastic-electrically conducting solidstrain energy driven surface diffusiontwo-dimensional finite element method

Mathematics Subject Classification ID

Structured surfaces and interfaces, coexistent phases (74A50) Finite element methods applied to problems in solid mechanics (74S05) Electromagnetic effects in solid mechanics (74F15)

Related Items (22)

Electromigration of intergranular voids in metal films for microelectronic interconnects. ⋮ A fitted finite element method for the numerical approximation of void electro-stress migration ⋮ A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion of Closed Curves ⋮ Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration ⋮ Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\) ⋮ Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects ⋮ A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion in Three Dimensions ⋮ A theoretical analysis of the electromigration-induced void morphological evolution under high current density ⋮ Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework ⋮ Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress ⋮ Analytical solution for motion of an elliptical inclusion in gradient stress field ⋮ Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion ⋮ Advances in the numerical treatment of grain-boundary migration: coupling with mass transport and mechanics ⋮ Finite element approximation of a phase field model for surface diffusion of voids in a stressed solid ⋮ Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films ⋮ Computation for electromigration in interconnects of microelectronic devices ⋮ A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids ⋮ Evolution of material voids for highly anisotropic surface energy ⋮ An unfitted finite element method for the numerical approximation of void electromigration ⋮ Pore migration under high temperature and stress gradients ⋮ Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires ⋮ A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid

Cites Work

• Inelastic deformation of porous materials
• Adaptive remeshing for compressible flow computations
• Stress singularities along a cycloid rough surface
• Some useful data structures for the generation of unstructured grids
• Automatic triangulation of arbitrary planar domains for the finite element method
• Local and global smoothing of discontinuous finite element functions using a least squares method
• Mass-conserved morphological evolution of hypocycloid cavities: a model of diffusive crack initiation with no associated energy barrier
• Note on an approximate method for computing consistent conjugate stresses in elastic finite elements

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