A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
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Cites work
- Adaptive remeshing for compressible flow computations
- Automatic triangulation of arbitrary planar domains for the finite element method
- Inelastic deformation of porous materials
- Local and global smoothing of discontinuous finite element functions using a least squares method
- Mass-conserved morphological evolution of hypocycloid cavities: a model of diffusive crack initiation with no associated energy barrier
- Note on an approximate method for computing consistent conjugate stresses in elastic finite elements
- Some useful data structures for the generation of unstructured grids
- Stress singularities along a cycloid rough surface
Cited in
(22)- Pore migration under high temperature and stress gradients
- Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires
- A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects
- A theoretical analysis of the electromigration-induced void morphological evolution under high current density
- Evolution of material voids for highly anisotropic surface energy
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
- Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration
- Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress
- Advances in the numerical treatment of grain-boundary migration: coupling with mass transport and mechanics
- An unfitted finite element method for the numerical approximation of void electromigration
- A fitted finite element method for the numerical approximation of void electro-stress migration
- Analytical solution for motion of an elliptical inclusion in gradient stress field
- Finite element approximation of a phase field model for surface diffusion of voids in a stressed solid
- A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion of Closed Curves
- Computation for electromigration in interconnects of microelectronic devices
- A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids
- Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\)
- A Symmetrized Parametric Finite Element Method for Anisotropic Surface Diffusion in Three Dimensions
- Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework
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