Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
DOI10.1016/S0022-5096(98)00079-9zbMATH Open0964.74073OpenAlexW2010765420MaRDI QIDQ1968692FDOQ1968692
Publication date: 16 July 2001
Published in: Journal of the Mechanics and Physics of Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/s0022-5096(98)00079-9
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surface diffusionthree-dimensional finite element methodelectromigrationidealized interconnect linestrain induced rougheningthin epitaxial film
Technical applications of optics and electromagnetic theory (78A55) Structured surfaces and interfaces, coexistent phases (74A50) Finite element methods applied to problems in solid mechanics (74S05)
Cites Work
- A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
- Adaptive remeshing for compressible flow computations
- Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure
- Modified shape functions for the three-node plate bending element passing the patch test
- Evolution of roughness on the surface of a strained elastic material due to stress-driven surface diffusion
- Evolution of waviness on the surface of a strained elastic solid due to stress-driven diffusion
- Stress singularities along a cycloid rough surface
Cited In (11)
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects
- A fitted finite element method for the numerical approximation of void electro-stress migration
- Finite element approximation of a three dimensional phase field model for void electromigration
- From Bell shapes to pyramids: a reduced continuum model for self-assembled quantum dot growth
- Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\)
- Numerical simulations of island formation in a coherent strained epitaxial thin film system
- Simulations of the spreading of a vesicle on a substrate surface mediated by receptor-ligand binding
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires
- A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids
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