Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion
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Publication:1968692
Recommendations
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Cites work
- A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
- Adaptive remeshing for compressible flow computations
- Evolution of roughness on the surface of a strained elastic material due to stress-driven surface diffusion
- Evolution of waviness on the surface of a strained elastic solid due to stress-driven diffusion
- Modified shape functions for the three-node plate bending element passing the patch test
- Some general properties of stress-driven surface evolution in a heteroepitaxial thin film structure
- Stress singularities along a cycloid rough surface
Cited in
(13)- Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires
- Simulations of the spreading of a vesicle on a substrate surface mediated by receptor-ligand binding
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- Numerical simulations of island formation in a coherent strained epitaxial thin film system
- Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
- An unfitted finite element method for the numerical approximation of void electromigration
- A fitted finite element method for the numerical approximation of void electro-stress migration
- Electromigration-driven evolution of the surface morphology and composition for a bi-component solid film
- A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids
- Phase field computations for surface diffusion and void electromigration in \({\mathbb{R}^3}\)
- Finite element approximation of a three dimensional phase field model for void electromigration
- From Bell shapes to pyramids: a reduced continuum model for self-assembled quantum dot growth
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