Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692)
From MaRDI portal
!
This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use the normal view instead:
scientific article; zbMATH DE number 1419571
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
||
| English | Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
scientific article; zbMATH DE number 1419571 |
Statements
Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (English)
0 references
16 July 2001
0 references
idealized interconnect line
0 references
strain induced roughening
0 references
thin epitaxial film
0 references
three-dimensional finite element method
0 references
electromigration
0 references
surface diffusion
0 references
0 references
0 references
0 references
0 references
0.7949391603469849
0 references
0.7861611843109131
0 references
0.7850326895713806
0 references
0.7789196372032166
0 references
0.7732668519020081
0 references
