Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692)
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scientific article; zbMATH DE number 1419571
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| English | Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion |
scientific article; zbMATH DE number 1419571 |
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Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (English)
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16 July 2001
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idealized interconnect line
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strain induced roughening
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thin epitaxial film
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three-dimensional finite element method
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electromigration
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surface diffusion
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0.7949391603469849
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0.7861611843109131
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0.7850326895713806
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0.7789196372032166
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0.7732668519020081
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