Pages that link to "Item:Q1968692"
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The following pages link to Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion (Q1968692):
Displayed 6 items.
- Instabilities of core-shell heterostructured cylinders due to diffusions and epitaxy: Spheroidization and blossom of nanowires (Q1025204) (← links)
- Simulations of the spreading of a vesicle on a substrate surface mediated by receptor-ligand binding (Q1025783) (← links)
- Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects (Q1399667) (← links)
- Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405) (← links)
- Numerical simulations of island formation in a coherent strained epitaxial thin film system (Q1975874) (← links)
- A lattice-based micromechanical continuum formulation for stress-driven mass transport in polycrystalline solids (Q5939627) (← links)
