Electromigration of intergranular voids in metal films for microelectronic interconnects. (Q1873405)
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| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Electromigration of intergranular voids in metal films for microelectronic interconnects. |
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Electromigration of intergranular voids in metal films for microelectronic interconnects. (English)
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20 May 2003
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finite difference scheme
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Runge-Kutta integration scheme
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static Laplace equation
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