Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects

DOI10.1016/S0021-9991(03)00199-2MaRDI QIDQ1399667zbMATH OpenFDO

Authors M. Nathan, Igor Ravve, M. Israeli, Amir Averbuch

Publication date 30 July 2003

Published in Journal of Computational Physics (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/S0021-9991(03)00199-2

zbMATH Keywords

classical Mullins problemdiffusion modelelectromigrationgrain-void interface

Mathematics Subject Classification ID

Technical applications of optics and electromagnetic theory (78A55) Finite difference methods applied to problems in optics and electromagnetic theory (78M20)

Recommendations

• Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces
• Electric field induced surface diffusion and micro/nano-scale island growth
• Electromigration-driven evolution of the surface morphology and composition for a bi-component solid film
• Electron dynamics at metal surfaces induced by and observed with STM
• The structure of the electrical double layer at the metal-vacuum interface
• Dewetting of nanometer thin films under an electric field
• THE MORPHOLOGY AND EVOLUTION OF THE SURFACE IN EPITAXIAL AND THIN FILM GROWTH: A CONTINUUM MODEL WITH SURFACE DIFFUSION

Cites work

• A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
• A level set approach to a unified model for etching, deposition, and lithography. I: Algorithms and two-dimensional simulations
• A level set approach to a unified model for etching, deposition, and lithography. II: Three-dimensional simulations
• A level set approach to a unified model for etching, deposition, and lithography. III: Redeposition, reemission, surface diffusion, and complex simulations
• A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
• A variational level set approach to multiphase motion
• An axisymmetric model of pore-grain boundary separation
• Approximate Green's functions in boundary integral analysis
• Computation for electromigration in interconnects of microelectronic devices
• Electromigration of intergranular voids in metal films for microelectronic interconnects.
• Evolving material structures of small feature sizes
• Free energy of a nonuniform system. I: Interfacial free energy
• scientific article; zbMATH DE number 1002694 (Why is no real title available?)
• scientific article; zbMATH DE number 976936 (Why is no real title available?)
• Numerical simulations of island formation in a coherent strained epitaxial thin film system
• Three-dimensional finite element analysis of the evolution of voids and thin films by strain and electromigration induced surface diffusion

Cited in

(5)

• Electromigration of intergranular voids in metal films for microelectronic interconnects.
• Irreversible thermodynamics of triple junctions during the intergranular void motion under the electromigration forces
• Electromigration failure of metal lines
• Numerical simulation of grain-boundary grooving by level set method
• Cathode edge displacement by voiding coupled with grain boundary grooving in bamboo like metallic interconnects by surface drift-diffusion under the capillary and electromigration forces

Describes a project that uses

Uses Software

• SERBA

This page was built for publication: Surface evolution in bare bamboo-type metal lines under diffusion and electric field effects

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q1399667)