Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration

DOI10.1016/J.EUROMECHSOL.2022.104600zbMATH Open1496.74041OpenAlexW4220730108MaRDI QIDQ2134405FDOQ2134405

Authors: Jiaming Zhang, Peizhen Huang 

Publication date: 3 May 2022

Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.euromechsol.2022.104600

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zbMATH Keywords

asymptotic analysisfinite element methodelectric field intensitymicrostructure evolution theorytwo-dimensional intragranular voidvoid morphological evolution

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Finite element methods applied to problems in solid mechanics (74S05) Analytic approximation of solutions (perturbation methods, asymptotic methods, series, etc.) of dynamical problems in solid mechanics (74H10) Granularity (74E20)

Cites Work

• A finite element analysis of the motion and evolution of voids due to strain and electromigration induced surface diffusion
• A phase field model for the electromigration of intergranular voids
• Title not available (Why is that?)
• A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
• Evolution of penny-shaped microcracks by interface migration.
• A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy

Cited In (10)

• A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
• Evolution of penny-shaped microcracks by interface migration.
• Multiscale modeling of degradation and failure of interconnect lines driven by electromigration and stress gradients
• Anisotropic phase field solution for morphological evolution and migration of inclusions in piezoelectric films
• A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy
• A theory for stress-driven interfacial damage upon cationic-selective oxidation of alloys
• A phase field model for the electromigration of intergranular voids
• A theoretical analysis of the electromigration-induced void morphological evolution under high current density
• Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field
• Continuum modeling of charged vacancy migration in elastic dielectric solids, with application to perovskite thin films

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