Phase-field crystal simulation of the evolution of voids in polycrystalline Au-Al bonds with elastic interaction and the Kirkendall effect
DOI10.1016/J.EUROMECHSOL.2023.105215OpenAlexW4390102607MaRDI QIDQ6196350FDOQ6196350
Authors:
Publication date: 14 March 2024
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2023.105215
Recommendations
- Void nucleation by vacancy condensation
- A phase field model for failure in interconnect lines due to coupled diffusion mechanisms.
- Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration
- Electromigration of intergranular voids in metal films for microelectronic interconnects.
- Phase field microelasticity accommodating large deformation and modeling of voids evolution under creep
Cahn-Hilliard equationelastic interactionpolycrystalmass migrationdiffusion couplesemi-implicit Fourier spectral algorithm
Spectral and related methods applied to problems in solid mechanics (74S25) Crystalline structure (74E15)
Cites Work
This page was built for publication: Phase-field crystal simulation of the evolution of voids in polycrystalline Au-Al bonds with elastic interaction and the Kirkendall effect
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q6196350)