Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field

DOI10.1016/J.AMC.2015.01.102MaRDI QIDQ669730zbMATH OpenOpenAlexFDO

Authors Simon Vigonski, Mihkel Veske, Alvo Aabloo, Flyura Djurabekova, Vahur Zadin

Publication date 15 March 2019

Published in Applied Mathematics and Computation (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.amc.2015.01.102

zbMATH Keywords

finite element simulationsmultiscale simulationsmolecular dynamics simulationssurface stress modelvoid under copper surface

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Composite media; random media in optics and electromagnetic theory (78A48)

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Cites work

• A finite element framework for continua with boundary energies. I: The two-dimensional case
• A finite element framework for continua with boundary energies. II: The three-dimensional case
• A modified Newton method for the solution of ill-conditioned systems of nonlinear equations with application to multiple shooting
• A surface Cauchy–Born model for nanoscale materials
• An XFEM/level set approach to modelling surface/interface effects and to computing the size-dependent effective properties of nanocomposites
• An embedded atom hyperelastic constitutive model and multiscale cohesive finite element method
• Continuum interpretation of virial stress in molecular simulations
• Fast parallel algorithms for short-range molecular dynamics
• Modeling materials. Continuum, atomistic and multiscale techniques.
• The Art of Molecular Dynamics Simulation

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