Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field

DOI10.1016/J.AMC.2015.01.102zbMATH Open1410.74025OpenAlexW2018861908MaRDI QIDQ669730FDOQ669730

Authors: Simon Vigonski, Mihkel Veske, Alvo Aabloo, Flyura Djurabekova, Vahur Zadin 

Publication date: 15 March 2019

Published in: Applied Mathematics and Computation (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.amc.2015.01.102

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zbMATH Keywords

finite element simulationsmultiscale simulationsmolecular dynamics simulationssurface stress modelvoid under copper surface

Mathematics Subject Classification ID

Electromagnetic effects in solid mechanics (74F15) Composite media; random media in optics and electromagnetic theory (78A48)

Cites Work

• Fast parallel algorithms for short-range molecular dynamics
• A finite element framework for continua with boundary energies. II: The three-dimensional case
• A finite element framework for continua with boundary energies. I: The two-dimensional case
• An XFEM/level set approach to modelling surface/interface effects and to computing the size-dependent effective properties of nanocomposites
• Modeling materials. Continuum, atomistic and multiscale techniques.
• The Art of Molecular Dynamics Simulation
• A modified Newton method for the solution of ill-conditioned systems of nonlinear equations with application to multiple shooting
• A surface Cauchy–Born model for nanoscale materials
• Continuum interpretation of virial stress in molecular simulations
• An embedded atom hyperelastic constitutive model and multiscale cohesive finite element method

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