Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field (Q669730)
From MaRDI portal
 | This is the item page for this Wikibase entity, intended for internal use and editing purposes. Please use this page instead for the normal view: Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field |
scientific article; zbMATH DE number 7037029
| Language | Label | Description | Also known as |
|---|---|---|---|
| default for all languages | No label defined |
||
| English | Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field |
scientific article; zbMATH DE number 7037029 |
Statements
Verification of a multiscale surface stress model near voids in copper under the load induced by external high electric field (English)
0 references
15 March 2019
0 references
finite element simulations
0 references
molecular dynamics simulations
0 references
multiscale simulations
0 references
surface stress model
0 references
void under copper surface
0 references
0 references
0 references
0 references
0.7057058811187744
0 references
0.677278995513916
0 references
0.6708305478096008
0 references
0.6654266119003296
0 references
