Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (Q2134405)
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scientific article; zbMATH DE number 7516654
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| English | Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration |
scientific article; zbMATH DE number 7516654 |
Statements
Phase field simulation of healing and growth of voids in interconnects under electric field-induced interface migration (English)
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3 May 2022
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two-dimensional intragranular void
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void morphological evolution
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microstructure evolution theory
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asymptotic analysis
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electric field intensity
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finite element method
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0.8529333472251892
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0.8052789568901062
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0.8052669167518616
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0.8003385663032532
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0.7659857869148254
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