A thermodynamic model for electrical current induced damage

DOI10.1016/J.IJSOLSTR.2003.08.018MaRDI QIDQ1434684zbMATH OpenOpenAlexWikidataFDO

Authors Cemal Basaran, Minghui Lin, Hua Ye

Publication date 12 July 2004

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijsolstr.2003.08.018

zbMATH Keywords

diffusionelectromigrationnanomechanicssolder jointsvoid growth

Mathematics Subject Classification ID

Thermodynamics in solid mechanics (74A15) Electromagnetic effects in solid mechanics (74F15) Fracture and damage (74R99)

Review text

Based on thermodynamics, statistical mechanics, continuum damage mechanics and atomic diffusion, an evolution model is presented for electromigration-induced damage. The model agrees with Black's empirical model, which was obtained from experimental data, where it was shown that the mean time to failure is related to the inverse power of two of the current density. In this paper entropy production due to electromigration is proposed as a damage metric. The proposed damage evolution model includes the effect of electrical field forces, stress gradient effect, vacancy concentration and the thermal gradient.

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(8)

• A theory of damage and self-regenerating materials
• Introducing damage mechanics templates for the systematic and consistent formulation of holistic material damage models
• Mathematical model of thermal breakdown of electrical insulation made of polymer composite
• Interface balance laws, phase growth and nucleation conditions for multiphase solids with inhomogeneous surface stress
• A phase field computational procedure for electromigration with specified contact angle and diffusional anisotropy
• Electromigration induced strain field simulations for nanoelectronics lead-free solder joints
• Electromigration failure of metal lines
• Peridynamic modeling of void nucleation and growth in metal lines due to electromigration in a finite element framework

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