Failure modes and FEM analysis of power electronic packaging

DOI10.1016/S0168-874X(01)00094-4MaRDI QIDQ5958496zbMATH OpenOpenAlexWikidataFDO

Authors Hua Ye, Minghui Lin, Cemal Basaran

Publication date 3 March 2002

Published in Finite Elements in Analysis and Design (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0168-874x(01)00094-4

zbMATH Keywords

electronic packagingfailure modesfinite element analysisIGBTpower electronic packagingreliability

Mathematics Subject Classification ID

Statistical mechanics of semiconductors (82D37)

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(9)

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• Transient of power pulse and its sequence in power electronics
• An improved high-voltage IGBT-based half-bridge DC/DC converter for railway applications
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• A fast power loss calculation method for long real time thermal simulation of IGBT modules for a three-phase inverter system
• A termination structure of 2.5kV IGBT with field plate and semi-resistive (SIPOS) layer
• Lifetime prediction and failure analysis of IGBT module based on accelerated lifetime test
• Real-time Prognosis of Failure of the IGBT in a Conversion Chain
• Fatigue and fracture assessment for reliability in electronics packaging

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