In-package P/G planes analysis and optimization based on transmission matrix method

DOI10.1631/JZUS.A071489MaRDI QIDQ943124zbMATH OpenOpenAlexFDO

Authors Yin-Jun Wang, Cheng Zhuo, Jun-Yong Deng, Jin-Fang Zhou, Kang-Sheng Chen

Publication date 8 September 2008

Published in Journal of Zhejiang University. Science A (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1631/jzus.a071489

zbMATH Keywords

decoupling capacitorirregular partitionpower integrity (PI)power/ground (P/G) planessimultaneous switching noise (SSN)transmission matrix method (TMM)

Mathematics Subject Classification ID

Analytic circuit theory (94C05)

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(4)

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• Derivation of the maximum voltage drop in power grids of integrated circuits with an array bonding package

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