Interface behavior of a bi-material plate under dynamic loading. Cohesive interface debonding
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Cites work
- A Continuum Model for Void Nucleation by Inclusion Debonding
- Cohesive zone model based analytical solutions for adhesively bonded pipe joints under torsional loading
- Local elastodynamic stresses in the unit cell of a woven fabric composite
- Mixed Mode Cracking in Layered Materials
- The relation between crack growth resistance and fracture process parameters in elastic-plastic solids
- Two bonded half planes with a crack going through the interface
Cited in
(8)- Cohesive zone modeling of interfacial stresses in plated beams
- Mechanics of transonic debonding of a bimaterial interface: The anti- plane shear case
- Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading
- Precracking and interfacial delamination in a bi-material structure: static and dynamic loadings
- Interface delamination of bi-material structure under dynamic time harmonic loading
- Interface delamination of bi-material structure under time harmonic load. Cohesive behaviour of the interface
- Bi-interfacial debonding of coated fiber reinforced composites under fatigue load
- Thermoelastic analysis of a bi-layered system with the single domain inclusion-based boundary element method
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