Mechanics of transonic debonding of a bimaterial interface: The in-plane case (Q1354917)
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| Language | Label | Description | Also known as |
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| English | Mechanics of transonic debonding of a bimaterial interface: The in-plane case |
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Mechanics of transonic debonding of a bimaterial interface: The in-plane case (English)
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22 January 1998
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Recent experiments have focused attention on the transonic debonding of a bimaterial interface. Here we discuss the in-plane transonic debonding case. We present complete solutions under conditions of both plane strain and plane stress for an interfacial crack advancing within various velocity regimes below the longitudinal wave speed of the stiffer material component. The stress singularities and the angular stress distributions in different transonic regimes are determined in closed form. The boundedness of energy flow across the interface precludes debonding beyond the higher Rayleigh wave speed.
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energy flow across interface
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plane strain
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plane stress
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interfacial crack
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longitudinal wave speed
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stress singularities
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angular stress distributions
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Rayleigh wave speed
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